Opening Ceremony
 
Date: April 27, 2010 / 10:00
Place: Exhibition Hall Entrance

Welcoming Reception
 
Date: April 27, 2010 / 17:30-20:00
Place: Grand Ballroom A, KINTEX

International Conference (WECC / AFEC conference)
 
WECC(World Electronic Circuits Council) conference


AFEC(Asian Federation of Electronic Circuits) conference

Date: April 27 ~ 29, 2010

International Symposium
 


Date: April 27~29, 2010
Place: Room No. 212 ~ 213, Convention Hall, KINTEX

Schedule Subject Company
4. 27 13:00-13:50 [Keynote Speech Ⅰ] World PCB Market Trend in 2010 NTI
14:00-14:50 Technology Trend of the latest LED Board Denki Kagaku Kogyo
Kabushiki Kaisha
14:30-15:20 Technology Trend of PKG Board JIEP / Interconnection
technology
15:30-16:20 Technology Trend of thermal Radiation LED Board KETI
4. 28 10:00-10:50 [Keynote Speech Ⅱ] Technology Trend of Embedded
PKG Board in next Generation		 Hynix Semiconductor
11:00-11:50 Technology and Market Trend for
the latest Embedded oard		 Samsung Electro-Mechanics
13:00-13:50 Trend of Int’l Standardization on Embedded Board JPCA
14:00-14:50 Trend of the design on SMT
(surface mount technology) 		JPCA
15:00-15:50 Technology Trend of FCCSP, partⅠ Samsung Electornics
16:00-16:50 Technology trend of Printed Circuit board
by using Cellphone		 Samsung Electro-Mechanics
4. 29 10:00-10:50 [Keynote Speech Ⅲ] Technology and
Market Trend for Semiconductor PKG Board		 Amkor Technology
11:00-11:50 Technology Trend of TAB/COF STEMCO
13:00-13:50 Technology Trend of CCL for using LED Board Doosan Corporation
Electro-Materials
14:00-14:50 Technology Trend of FCCSP Ⅱ Qualcomm Korea
15:00-15:50 The latest Technology Trend of process of Surface The Korean Institute of
Surface Engineering
▶ Application Needed (Chargeable)
▶ KPCA reserves the right to changes the schedule
▶ Simultaneous Interpretation Provided
▶ For more information, contact KPCA (T. +82 2 786 7629 /kpca@kpca.or.kr)

Supported by : The Microelectronics and Packaging Society
NPI (New Product Introduction)
  Date : 28. April, 2010(WED)
Place : Convention Hall No. 211A, 211B

Rm. Time Subject Company Inquiry
211A 10:30-11:30 Fine pattern etching technology and its application technology HWABAEK ENGINEERING +82-31-492-1678
211A 14:00-17:00 FUJIFILM New Glass Mask SUNGDO GL +82-2-3406-7006
211B 13:30-14:30 Reduce the Manufacturing Pocess of Rigid-Flex and Save its Costs by Replacing the PI Coverlay Film with PI Ink

SECHANG CHEMICAL CO., LTD.

 +82-32-581-5030
211B 15:00-16:00 Universal finish solderbond Flex(Enepig for flexible PCB’s)

ATOTECH KOREA LTD.

 +82-2-550-7261
▶ Free Admission
▶ Organizer reserves the right to make changes the schedule
▶ For more information, contact each exhibitor organizing the NPI
 
KPCAshow 2010